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About » Program Committee
Executive Technical Program Committee
Mahmoud Almasri
University of Missouri
USA
Maria Asplund
Chalmers University of Technology
SWEDEN
Gaurav Bahl
University of Illinois
USA
Clementine Boutry
TU Delft
NETHERLANDS
Joseph Brown
University of Hawai‘i at Mānoa
USA
Humberto Campanella
Silicon Austria Labs GmbH
AUSTRIA
Saurabh Chandorkar
Indian Institute of Science
INDIA
Jian Chen
Chinese Academy of Sciences
CHINA
Jungwook Choi
Chung-Ang University
KOREA (ROK)
Gerard Cummins
University of Birmingham
UK
Liang Dong
University of Georgia
USA
David Elata
Technion - Israel Inst. of Technology
ISRAEL
Juliet Gopinath
UC Boulder
USA
Einar Halvorsen
University of South-Eastern Norway
NORWAY
Gilgueng Hwang
The University of Tokyo
JAPAN
Mehdi Javanmard
Rutgers University New Brunswick
USA
Albert Kim
University of South Florida
USA
Hanseup Kim
University of Utah
USA
Hoe Joon Kim
DGIST
KOREA (ROK)
Michael Kraft
KU Leuven
BELGIUM
Ching-Te Kuo
National Sun Yat-sen University
TAIWAN
Nathan Lazarus
University of Delaware
USA
Chengkuo Lee
National University of Singapore
SINGAPORE
Chung Hoon Lee
Marquette University
USA
Dong-Weon Lee
Chonnam National University
KOREA (ROK)
Joshua Lee
University of Technology
AUSTRALIA
Ming-Huang Li
National Tsing Hua University
TAIWAN
Andreu Llobera
Silicon Austria Labs
AUSTRIA
Hiroaki Onoe
Keio University
JAPAN
Niels Quack
Universität Stuttgart
GERMANY
Lillo Raia
STMicroelectronics
ITALY
Mina Rais-Zadeh
NASA JPL
USA
Matteo Rinaldi
Northeastern University
USA
Marc Sansa
CEA-Leti
FRANCE
Ulrich Schmid
TU Wien
AUSTRIA
Seonho Seok
CNRS
FRANCE
Ashwin Seshia
IIT Bombay
INDIA
Ryan Sochol
University of Maryland
USA
Sameer Sonkusale
Tufts University
USA
Boris Stoeber
The University of British Columbia
CANADA
Yuji Suzuki
The University of Tokyo
JAPAN
Alexander Trusov
Northrop Grumman
USA
Elizaveta Vereshchagina
SINTEF Digital
NORWAY
Guillermo Villanueva
EPFL
SWITZERLAND
Zhenyu Wu
Chinese Academy of Sciences
CHINA
Hemin Zhang
Northwestern Polytechnical University
CHINA
Chun Zhao
University of York
UK
Yao Zhu
Institute of Microelectronics, A*STAR
SINGAPORE
David Elata
Hemin Zhang
Yao Zhu
